Peter's Electronics
Binary EP321-MEMS 6-Driver Tribrid IEM 2DD+3BA+MEMS Direct Drive Hi-Res Audiophile In-Ear Monitor Earphone HiFi Music Earbuds
Binary EP321-MEMS 6-Driver Tribrid IEM 2DD+3BA+MEMS Direct Drive Hi-Res Audiophile In-Ear Monitor Earphone HiFi Music Earbuds
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SPECIFICATIONS
Active Noise-Cancellation: No
Category: Earphones & Headphones
Charging Method: cable
Communication: Wired
Control Button: No
Feature: HiFi In-ear Earphone
Features: Detachable Cable
Frequency Response Range: 8 - 40000
Function: HiFi Headphone,Monitor Headphone
Headphone Pads Material: Silicone
High-concerned chemical: None
Impedance Range: up to 32 Ω
Is wireless: No
Line Length: 1.2
Material: PC
Package List: User Manual,Carrying Bag,Replaceable Pads Set,Detachable Audio Cable
Plug Type: Line Type
Resistance: 13
Sensitivity: 122
Style: Wired in-ear headphones
Total Harmonic Distortion: 1
Vocalism Principle: Hybrid Technology
Voice assistant built-in: no
Volume Control: No
Waterproof: No
Wireless Type: None
With Microphone: No
💡About EP321 MEMS Driver👇
The EP321 is equipped with an ultra-compact MEMS tweeter unit, with a package size of only 15.4mm³, which may be the smallest MEMS speaker unit in the audio industry today. Based on PZT thin-film piezoelectric technology, the diaphragm and driving structure are integrated and fabricated entirely using MEMS processes. In terms of acoustic performance, it offers excellent high-frequency extension and can easily extend beyond 40kHz, delivering an exceptional sound quality experience that meets Hi-Res certification standards.
To achieve the required sound pressure level (SPL) technical specifications, existing piezoelectric MEMS speaker solutions on the market currently need an additional dedicated PA chip to maintain a high drive voltage. The new MEMS unit on the EP321 can easily achieve SPL≥100dB @ 6kHz~40kHz with just a 1Vrms drive voltage, meaning it can deliver high-fidelity treble audio directly using existing headphone driving equipment without PA amplification, significantly lowering the application threshold for new MEMS speaker technologies.
Benefiting from excellent MEMS structural design and semiconductor process capabilities, it has outstanding response speed and consistency in sound pressure level (±1dB) and phase (±1°). Unlike similar products in the audio industry that use surface mount and wire bonding packaging schemes, it adopts AAC's specially developed "quasi-flip-chip" packaging process, achieving high reliability while ensuring high performance and ultra-compact package size.
2DD+3BA+MEMS Tribrid Drivers

Advanced Three-Types of Driver Configuration

Direct Drive MEMS Technology

Strong Details, Rich Tone

Precise Imaging & Accurate Vocals

Active+Passive Composite Bass Module

Sound Frequency Response

Exciting Design & Lightweight Shells

High-Precision 3D Printed Ear Cavity

Universal 0.78mm 2-Pin Connector







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